| 摘要 |
To produce a structure of a micro-electro-mechanical system (MEMS) in a hermetic cavity (38) of a microelectronic device (50), a prepared cover (30) and substrate (10) are bonded by means of silicon direct bonding (SDB). To optimise the preparation of surfaces by means of wet cleaning without impairing the properties of the MEMS (22), i.e. without causing adhesions, the MEMS structure (22) is not released during bonding, but attached to the base (12) by means of a sacrificial intermediate layer (16). Said layer is removed once bonding has been carried out by injecting HF vapour via a vent (40) opening into the cavity (38).
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