| 摘要 |
PURPOSE: An LED package is provided to prevent the deterioration of brightness by including a reflection member comprised of a coating layer and a reflection wall which are arranged on the outer circumference of the fluorescent material. CONSTITUTION: In an LED package, a substrate is arranged on the both sides of the LED chip and is bonded with the LED chip through a wire. An electrode(140) is arranged in the outer side of the substrate. A resin mould unit(150) molds the LED chip, a lower part of the substrate and the electrode. The fluorescent material layer(110) is formed on the resin mould unit. The fluorescent material layer comprises a reflecting member having the coating on the external side of the fluorescent material layer.
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