发明名称 |
Electronic devices having air gaps |
摘要 |
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
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申请公布号 |
US7723850(B2) |
申请公布日期 |
2010.05.25 |
申请号 |
US20070891857 |
申请日期 |
2007.08.13 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
GALLAGHER MICHAEL K.;GRONBECK DANA A.;ADAMS TIMOTHY G.;CALVERT JEFFREY M. |
分类号 |
H01L23/48;B81B7/00;H01L21/764;H01L21/768;H01L23/52;H01L23/522;H01L27/10;H01L29/40;H01L29/73;H01L29/74;H01L29/80;H01L31/112 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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