<p>PURPOSE: A clamping apparatus including a movable gripper is provided to clamp various sizes of semiconductor substrates in order to perform several semiconductor manufacturing processes without an interruption. CONSTITUTION: A main body in a disk shape rotates with respect to the center of the main body. Spaces in which a support plate(130) installed are arranged on the upper side and the lower side of the main body. A part of the support plate is combined to the main body and vertically moves. A fixing gripper(150) is combined and fixed to the main body. A clamp is arranged on the main body and includes a movable gripper(170) which horizontally moves.</p>
