| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique which can improve reliability of a module using a PCB as a module substrate. <P>SOLUTION: Solder connection by Pb free solder between a single chip component 43, an integrated chip component 44 and a semiconductor chip IC2 is carried out by heating treatment at a temperature lower than 280°C using a heat block, and solder connection of the semiconductor chip IC1 by high melting point solder is carried out by heating treatment at 280°C or higher using hot jet. Consequently, it is possible to perform solder connection for the semiconductor chip IC1 to a PCB 38 by using high melting point solder without generating damage of the PCB 38 due to heat, such as burning of solder resist and peeling of prepreg from a core material. As a result, the semiconductor chip IC1 can be mounted on the PCB 38 by high connection strength. <P>COPYRIGHT: (C)2010,JPO&INPIT |
