| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reinforcement member for a printed wiring board, which can reinforce a printed wiring board without using a reinforcement structure to be covered with a resin molding. Ž<P>SOLUTION: The reinforcement member 12 includes a first joint surface 13a, a second joint surface 13b and a third joint surface 16a. When solder is sandwiched between the first joint surface 13a and a printed wiring board, and a heating process is applied to a position where the second joint surface 13b is superposed on the third joint surface 16a in a state where and a plurality of the reinforcement members 12 are mounted, a portion of the welded solder enters between the second joint surface 13b and the third joint surface 16a, and the solder is solidified after the heating process is applied, whereby the reinforcement members 12 with the second joint surface 13b superposed on the third joint surface 16a are jointed to each other, and the respective reinforcement members 12 are jointed on the printed wiring board. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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