| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of highly reliably mounting a conductive ball on a connection pad and forming a bump electrode. <P>SOLUTION: The method of manufacturing a semiconductor device includes: a step of preparing a semiconductor wafer 10 having a connection pad C; a step of forming an insulating dam layer 20 in which an opening 20a is provided in an area including the connection pad C, on the semiconductor wafer 10; and a step of forming a bump electrode 40 by mounting a conductive ball 40a on the connection pad C in the opening 20a of the insulating dam layer 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
