| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, capable of securing flame retardancy without having to use a halogen-based flame retardant and superior in resolution, resistance to electrolytic corrosion, and storage stability, and a photosensitive film that uses the composition, and to provide a method of forming resist pattern, a printed wiring board, and a method of manufacturing the same. <P>SOLUTION: The photosensitive resin composition includes (A) a polymer including a carboxyl group, (B) a photopolymerizable compound containing an ethylenically unsaturated bond, (C) a photo polymerization initiator, and (D) a phenoxy phosphazene compound, wherein the content of the (D) component is 30-70 pts.wt. with respect to 100 pts.wt. of the total amount of the (A) component and the (B) component. <P>COPYRIGHT: (C)2010,JPO&INPIT |
