发明名称 RESIN MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To provide a resin molding die causing no void of such size as to impair appearance and performance of a product, in the surface of the product sealed with resin. SOLUTION: The resin molding die includes a cavity 11 which is a recess for placing the content of molding to be resin-molded; a lower die 10 having a runner 12 which is a passage for allowing resin in a molten state, supplied from a molding machine, to flow to the cavity 11; and an upper die arranged to contact and separate from a surface formed with the cavity 11 and runner 12 of the lower die 10. The runner 12 has a branch structure of branching the passage into a plurality of passages having smaller cross-sectional areas than the cross-sectional area, perpendicular to a resin injecting direction, of the passage, and one passage A1 formed on the side connected to the molding machine is structured to be branched into a plurality of passages A1111, A1112, A1121, A1122, A1211, A1212, A1221, A1222 connected to the cavity 11 at a plurality of points by a branch structure formed over a plurality of stages. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010111050(A) 申请公布日期 2010.05.20
申请号 JP20080286476 申请日期 2008.11.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA HISAO;TAKEDA YASUTOSHI
分类号 B29C45/27;B29L9/00;B29L31/34;H01L21/56 主分类号 B29C45/27
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