| 摘要 |
PROBLEM TO BE SOLVED: To achieve higher-density mounting by arranging chip components with higher degree of freedom on a circuit substrate. SOLUTION: When three chip components 20, 22, and 24 are mounted on a mounting surface of the circuit substrate 12, land parts 14 and 15, and 17 and 19 are previously formed at corresponding positions for the two chip components 20 and 22, which can be soldered by making cream solders S1 and S2 applied thereover reflow. For the remaining chip component 24, a cream solder S2 is applied over a resist film 18 from the adjacent land parts 15 and 17, and made to reflow in a state wherein the chip component 24 is arranged thereupon. Consequently, the electrodes 24a and 24b can be soldered to adjacent electrodes 20a and 22b respectively. COPYRIGHT: (C)2010,JPO&INPIT
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