| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die ejector that can be exfoliated from a metal foil, without damaging a semiconductor chip. <P>SOLUTION: The die ejector 1 includes a chamber 2, that can be made to go into a vacuum state and is equipped with a cover plate 3 having a hole 6; a plurality of plates 8, that are installed inside of the chamber and projected into the hole and that can also be displaced simultaneously or separately in the vertically or obliquely extending direction to the surface 9 of the cover plate; and drive means for displacing the plate. The drive means includes a motor 14 and a drive mechanism 12, having a pin 13 that is movable back and forth between two positions along a predetermined path by the motor. Each plate has a route-like opening. The pin is guided into the route-like opening in each plate. The route-like opening differs for each plate, such that when the pin moves along the route, the plate is displaced in this direction according to a predetermined procedure. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
