| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition of which the roughened surface of the cured product has high adhesiveness to a plated conductor and forms an insulating layer with a small coefficient of linear thermal expansion, even though the roughness of the roughened surface after the roughening of the cured product surface of the epoxy resin composition is relatively small. SOLUTION: The epoxy resin composition contains: (A) an epoxy resin, (B) an active ester compound, and (C) an alicyclic structure-containing phenoxy resin. COPYRIGHT: (C)2010,JPO&INPIT |
