发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF PACKAGE STACKING |
摘要 |
A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.
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申请公布号 |
US2010123233(A1) |
申请公布日期 |
2010.05.20 |
申请号 |
US20080273541 |
申请日期 |
2008.11.18 |
申请人 |
YOON IN SANG;LEE SEONGMIN;SONG SUNGMIN |
发明人 |
YOON IN SANG;LEE SEONGMIN;SONG SUNGMIN |
分类号 |
H01L21/50;H01L23/48 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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