发明名称 MOUNT BOARD AND SEMICONDUCTOR MODULE
摘要 A mount board includes a laminated wiring section including a plurality of wiring layers formed on a surface of a substrate in a laminated manner, wherein a portion of an inner wiring layer is exposed to the outside, the inner wiring layer being any of the plurality of wiring layers excluding an uppermost wiring layer.
申请公布号 US2010122838(A1) 申请公布日期 2010.05.20
申请号 US20090620216 申请日期 2009.11.17
申请人 SONY CORPORATION 发明人 ASAMI HIROSHI;YAMAGATA OSAMU
分类号 H05K1/00;H05K1/03 主分类号 H05K1/00
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