| 摘要 |
The invention relates to a method for detaching and removing a semiconductor chip (1) from a tape (3) in three phases. In the first phase, the semiconductor chip (1) is partially detached from the tape (3) using mechanical means, but without the participation of a chip gripper (11). In the second phase, the semiconductor chip (1) is completely detached from the tape (3), wherein the semiconductor chip (1) is held by the chip gripper (11). In the third phase, the chip gripper (11) is raised and moved away. |
