| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a direct exposure method and a direct exposure device of low cost and high-precision which will not cause positional deviations of an exposure pattern, resulting from yawing of a stage on which a substrate to be exposed is placed. <P>SOLUTION: The direct exposure method, in which a substrate to be exposed placed on a stage 52 that makes a relative movement to an exposure head 51 of the direct exposure device 1 is directly exposed by the exposure head 51, includes a correction step in which an arithmetic processing part 11 in the direct exposure device 1 corrects design data of a vector data form input in the direct exposure device 1, by referring to a correction table created beforehand, and creates design data after the correction; a conversion step in which the arithmetic processing part 11 converts the design data, after the correction into data for the device of a raster data form; and an exposure step, in which the exposure head 51 directly exposes the substrate to be exposed placed on the stage 52, that undergoes relative movement based on the data for the device. <P>COPYRIGHT: (C)2010,JPO&INPIT |
