| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device which does not stain a wafer when the ground wafer is carried out from a chuck table. SOLUTION: The grinding device includes a chuck table for holding a wafer, a grinding means which rotatably supports a grinding wheel for grinding the wafer held by the chuck table, and a carrying-out means for carrying out the wafer that is held by the chuck table out of the chuck table. The carrying-out means includes a chucking unit 104 which has a chucking surface for chucking and holding the wafer, a frame 102 which covers the chucking unit so that the chucking surface of the chucking unit is exposed, and a carrying arm 98 connected to the frame. The frame is provided with a water supply means including a plurality of water jetting holes 120 so that the water runs from the outer periphery of the frame to the chucking surface of the chucking unit and the chucking surface is always wetted with water. COPYRIGHT: (C)2010,JPO&INPIT |
