| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board mounted with an LSI package component etc., and an electronic device, a desired current value being secured for each package terminal even when connection terminals of the LSI package component etc., have a narrower pitch and more pins. SOLUTION: The printed wiring board has a plurality of vias including a first via and a second via connected to at least one of a land formed in a surface layer and a power supply pattern formed in a layer other than the surface layer where the land is formed, and a current is shunted to the plurality of vias. COPYRIGHT: (C)2010,JPO&INPIT |
