| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of replacing a device found to be defective among a plurality of electronic devices mounted on a substrate with a new device to relieve other devices. <P>SOLUTION: An electronic component includes a base insulating layer 10 having a first surface 12 and a second surface 14, an electronic device 18 having a first surface 20 and a second surface 22 and fixed to the base insulating layer 10, an adhesive layer 16 disposed between the first surface 20 of the electronic device 18 and the second surface 14 of the base insulating layer, and a removable layer 26 disposed between the first surface 20 of the electronic device 18 and the second surface 14 of the base insulating layer. The base insulating layer 10 is fixed to the electronic device 18 with the removable layer 26 interposed. The removable layer 26 serves to peel the base insulating layer 10 from the electronic device 18 at sufficiently low temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
