| 摘要 |
A semiconductor device includes a semiconductor substrate that includes first and second regions; first, second, and third insulating layers; a capacitor dielectric layer that includes first and second dielectric layers; a gate insulating layer formed on the first and second regions; a gate formed on the gate insulating layer of the second region; a first capacitor electrode formed on the capacitor dielectric layer; and impurity regions formed in the semiconductor substrate on sides of the gate. The first and second regions include first and second trenches, respectively. The third insulating layer is formed on the second insulating layer, which is formed on the first insulating layer, which is formed on an inner surface of the second trench. The second dielectric layer is formed on the first dielectric layer, which is formed on an inner surface of the first trench.
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