发明名称 ELECTROPLATING APPARATUS AND METHOD WITH UNIFORMITY IMPROVEMENT
摘要 An electroplating system is provided. The electroplating system includes a divided electrode that is arranged to simultaneously provide a plurality of line currents for an electroplating process. The system includes a current control component that is coupled to the divided electrode. The current control component is configured to determine the magnitude of each of the line currents. The current control component is also configured to regulate individual line currents based, at least in part, on the determined magnitude of each of the line currents.
申请公布号 US2010122908(A1) 申请公布日期 2010.05.20
申请号 US20080273289 申请日期 2008.11.18
申请人 SPANSION LLC 发明人 TAKEGUCHI NAOKI
分类号 C25D21/12;C25D17/00 主分类号 C25D21/12
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