| 摘要 |
A wiring board has a mounting region allowed for mounting of the semiconductor element, a solder layer is provided to the mounting region so as to bond the semiconductor element with the wiring board, and a divisional ridge which divides the solder layer into a plurality of regions in a plan view and surrounds the solder layer, is provided to the wiring board. A portion of the solder layer bonded to the semiconductor element has a thickness larger than the height of the divisional ridge. |
