| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally conductive emulsion filled with ≥2,000 pts.wt. of thermally conductive particles to 100 pts.wt. of water-soluble resin without spoiling processability. <P>SOLUTION: The thermally conductive emulsion shows an anionic or nonionic property, in which 2,000-8,000 pts.wt. of thermally conductive particles to 100 pts.wt. of resin component are dispersed in water-soluble resin solution with ≥70°C of glass transition temperature Tg when formed into a dry film. The thermally conductive emulsion is used as a high thermally conductive coating agent or adhesive, and shows high thermal conductivity of ≥5 W/m×K. Although thermally conductive particles are filled in high density, handling is easy owing to liquid form at 20°C, further, excellent in workability that the thermally conductive emulsion is formed into a film only by drying after applying to a part to be coated or the like. <P>COPYRIGHT: (C)2010,JPO&INPIT |
