| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an underfill agent suitable for a semiconductor device including a copper pillar bump. Ž<P>SOLUTION: The underfill agent composition includes following component (A) through (D): (A) 100 pts.mass of an epoxy resin, (B) an amine curing agent or an acid anhydride curing agent in an amount of an equivalent ratio [component (A)/component (B)] being 0.7 to 1.2, (C) 50-500 pts.mass of an inorganic filler based on total 100 pts.mass of the component (A) and component (B), and (D) 0.01-10 pts.mass of silane having an episulfide group represented by formula (1) based on total 100 pts.mass of the component (A) and component (B), wherein R<SP>1</SP>is a hydrogen atom, methyl, or ethyl, R<SP>2</SP>is a 2C-10C organic group which may include oxygen and may form a ring structure together with a carbon atom of the episulfide group, X is a hydrolyzable group, and k is an integer of 1 to 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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