发明名称 |
METHOD FOR MANUFACTURING AN IMAGE SENSOR |
摘要 |
<p>PURPOSE: A method for manufacturing an image sensor is provided to improve the amount of light which is received on a photo diode by adjusting the upper side of metal lines on the contact hole of the photo diode. CONSTITUTION: A circuit including an interlayer insulation layer(160) and a metal line is formed on a semiconductor substrate. A photo diode which includes a first doping layer(210) and a second doping layer(220) is formed on the interlayer insulation layer. A via-hole(240) which exposes a part of the metal line is formed by passing through the photo diode. A barrier pattern(260) is formed in the via-hole. A contact plug(270) is formed in the via-hole. A part of upper side of the contact plug is etched. An insulation layer is formed on the upper side of the contact plug.</p> |
申请公布号 |
KR20100052619(A) |
申请公布日期 |
2010.05.20 |
申请号 |
KR20080111420 |
申请日期 |
2008.11.11 |
申请人 |
DONGBU HITEK CO., LTD. |
发明人 |
YUN, KI JUN;RYU, SANG WOOK |
分类号 |
H01L27/146;H01L21/28;H01L27/14 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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