发明名称 PLANAR HEATING ELEMENT EMBEDDING PAVEMENT STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a planar heating element embedding pavement structure shortening a construction work time and reducing material/construction cost by only laying materials in an extremely thin-walled manner on a pavement surface R without digging up a road surface in construction. Ž<P>SOLUTION: The planar heating element embedding pavement structure 10 is constituted by forming, on the pavement surface R, a heat insulating underlayer 11 formed by applying a first pavement resin composition obtained by kneading an organic polymer, a filler, a hardening agent and a hardening accelerator, in a thin film state, laying a planar heating element 12 on the heat insulating underlayer 11, and forming, further on the planar heating element 12, a surface layer 13 formed by applying a second pavement resin composition obtained by kneading an organic polymer, a filler, a hardening agent and a hardening accelerator, in a thin film state, wherein the planar heating element 12 can be supplied with electric power. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010112132(A) 申请公布日期 2010.05.20
申请号 JP20080288209 申请日期 2008.11.10
申请人 SHINSEN KOICHIRO 发明人 NEJIME FUMIHIRO
分类号 E01C11/26;E01C7/32;H05B3/20 主分类号 E01C11/26
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