| 摘要 |
<p>A plating device has a plating vessel for receiving plating liquid (10), an anode installed so as to be immersed in the plating liquid (10) in the plating vessel, an adjustment plate (60) provided between the anode and a substrate (W) that is provided so as to be opposed to the anode, and a plating power source (24) for performing plating by passing electricity between the anode and the substrate (W). The adjustment plate (60) is provided so as to separate the plating liquid (10) received in the plating vessel (40) into the anode side and the side of an object to be plated. A perforation group formed of a large number of through- perforations (66) is provided in the plate.</p> |
