MICROSTRUCTURE PROBE CARD, AND MICROSTRUCTURE INSPECTING DEVICE, METHOD, AND COMPUTER PROGRAM

摘要

An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by suppressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided. When inspection on a microstructure is performed, first, a pair of probes (2) are caused to contact respective electrode pads (PD), and the pair of probes (2) and a fritting power source (50) are connected together through relays (30). Next, a voltage is applied from the fritting power source (50) to one probe (2) in the pair of probes (2). As the voltage is gradually increased, an oxide film between the pair of probes (2) is destroyed and a current flows between the pair of probes (2) by fritting phenomenon, and the probes (2) and the electrode pad (PD) are electrically conducted each other. Subsequently, the pair of probes (2) are switched to a measuring unit (40) side from the fritting power source (50) through the relays (30), and electrically connected to the measuring unit (40).