发明名称 Laminated magnetic material for inductors in integrated circuits
摘要 An embodiment is an inductor that may include a laminated material structure to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electroless plating techniques to form a layer or layers of magnetic material within the laminated material structure, and in particular those magnetic layers adjacent to insulator layers.
申请公布号 US7719084(B2) 申请公布日期 2010.05.18
申请号 US20060479302 申请日期 2006.06.30
申请人 INTEL CORPORATION 发明人 GARDNER DONALD S.;SCHROM GERHARD;HAZUCHA PETER;PAILLET FABRICE;KARNIK TANAY
分类号 H01L21/00 主分类号 H01L21/00
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