发明名称 |
Method for forming photoresist layer |
摘要 |
A method for forming a photoresist layer is provided. The method includes following steps. A wafer is provided in a semiconductor machine. The wafer is spun at a first spin speed. A pre-wet solvent is dispensed on the spinning wafer by using a nozzle disposed at a fixed position. The pre-wet solvent then stops dispensing. The spin speed of the wafer is adjusted from the first spin speed to a second spin speed which is faster than the first spin speed. Thereafter, a photoresist layer is coated on the wafer.
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申请公布号 |
US7718551(B2) |
申请公布日期 |
2010.05.18 |
申请号 |
US20080044621 |
申请日期 |
2008.03.07 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
LIU YU-HUAN;CHEN CHIH-JUNG;HUANG CHIH-CHUNG |
分类号 |
H01L21/00;B05D3/12;C08J7/04;H01L21/8242 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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