SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for fabricating the same are provided to improve productivity of a semiconductor package by preventing a defect in manufacturing a semiconductor package. CONSTITUTION: A semiconductor package(100) comprises a substrate(110), a semiconductor chip(120), and an adhesive member(130). The semiconductor chip is arranged on the substrate. The semiconductor chip comprises a plurality of fuse boxes(124). A plurality of fuse boxes are opposite to the substrate. The semiconductor chip comprises a protective film(126). The protective film exposes the fuse box. A penetration bent groove(132) is interposed between the substrate and the semiconductor chip. The penetration bent groove exposes the space formed on the fuse boxes.