INTERPOSER AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: An interposer and a semiconductor package using the same are provided to shorten a process time by laminating a plurality of semiconductor chips by using the interposer. CONSTITUTION: A supporting plate(110) comprises an upper and lower side which are opposite to each other. A plurality of via patterns are formed from the upper side to the lower-side of the supporting plate. A first insulating layer(122) exposes a part of the via patterns. First interconnections(132) are formed on exposed via patterns. A solder mask(142) exposes one part of the first interconnections. The first solder mask is formed on the first interconnections and the first insulating layer. The second insulating layer(124) is formed on the lower side of the supporting plate. The second insulating layer exposes a part of the via patterns. Second wirings(134) are formed on the exposed via patterns.