| 摘要 |
<p>Disclosed is a mold temperature control circuit of an injection molding device which repeats a molding cycle that includes circulating the heating medium to a mold to heat resin to a temperature suitable for resin injection before resin injection, switching from a heating medium to a cooling medium after resin injection, and circulating the cooling medium to the mold to cool the resin down to the solidification temperature of the resin or below, wherein combined pipings are shared by piping for supplying to the mold the heating medium, the cooling medium and compressed air for scavenging, and by piping for discharging the heating medium, the cooling medium and the compressed air for scavenging. The mold temperature control circuit of an injection molding device comprises mold bypass piping which connects together the combined piping on the heating-medium supply side and the combined piping on the discharge side, a mold bypass on/off valve, a passing heating medium sensor, and a mold temperature controller storing therein a mold temperature determination program and a passing heating medium determination program.</p> |
