SEMICONDUCTOR DEVICE

摘要

An external device (H) such as a mobile phone or a digital communication device includes a mobile RF section (23) and a host MPU (21). The mobile RF section (23) performs high frequency power amplification to output a high frequency signal for performing wireless communication via an antenna, a signal processing to transmit the signal received by the antenna in wireless communication to the host MPU (21), and the like. The host MPU (21) performs all controls in the external device (H). The host MPU (21) is connected to a SIM card socket portion (14) which is inserted in a semiconductor device (1) via an ISO terminal (20). The SIM card socket portion (14) can be removed from the semiconductor device (1) at a connection point between a secure chip for SIM (22) and an NFC chip (9a) of the semiconductor device (1).