| 摘要 |
<p>Provided is an electron beam type substrate inspecting apparatus (1) which can inspect a substrate to be inspected (8) in a short time. The inspecting apparatus is provided with: means (11, 12) which make an inspecting region on the substrate to be inspected (8) scanned with an electron beam (9); a means (7) which detects signals generated from the substrate to be inspected (8); a means (13) which performs imaging by associating the scanning position on the inspecting substrate (8) with the signals; a means (15a) which generates on layout, based on arrangement data and design data (19) of a plurality of semiconductor devices formed on the substrate to be inspected (8), at least one region among a die region indicating a range wherein the semiconductor devices exist on the substrate to be inspected (8), a logic circuit region indicating a range wherein a logic circuit exists in the semiconductor devices, a memory circuit region indicating a range wherein a memory circuit exists, and a peripheral circuit region indicating a range wherein a peripheral circuit exists; and a means (15b) which sets the region to be inspected by using the generated region.</p> |
