| 摘要 |
PURPOSE: An electroplating device and an electroplating method using the same are provided to deposit a copper film with uniform thickness in a wafer by uniformly supplying current to the wafer. CONSTITUTION: An electroplating device is composed of a reactor(100), an electrolyte layer(210), electrodes(204), and a power supply unit. A wafer(220) is arranged on the top surface of the electrolyte layer. The electrodes are arranged on the bottom surface of the reactor, and supply current to the electrolyte layer. The power supply unit supplies voltage to the electrodes.
|
