发明名称 MICRO ELECTROMECHANICAL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a micro electromechanical device capable of heightening performance of both a micro electromechanical element and an integrated circuit. <P>SOLUTION: In a gyro sensor device wherein a gyro sensor which is a micro electromechanical element and an integrated circuit 3 are formed on one element formation substrate 1, the element formation substrate 1 is a multilayer substrate having a silicon substrate (first semiconductor substrate) 1A and a silicon substrate (second semiconductor substrate) 1B provided on one surface side in the thickness direction of the silicon substrate 1A, and having a larger resistivity than the silicon substrate 1A, the gyro sensor is formed over the silicon substrate 1A and the silicon substrate 1B, and the integrated circuit 3 is formed on the silicon substrate 1B. A support substrate 2 fixed on the other surface side of the silicon substrate 1A is provided, and a moving part of the gyro sensor is positioned in a sealed space enclosed by a peripheral part of the silicon substrate B and the silicon substrate 1A and by the support substrate 2. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010107521(A) 申请公布日期 2010.05.13
申请号 JP20100020429 申请日期 2010.02.01
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 TSUJI KOJI;EDA KAZUO;OKUTO TAKASHI;OKA NAOMASA;MIYAJIMA HISAKAZU;SAIJO TAKASHI;KIRIHARA MASAO
分类号 G01C19/56;B81B3/00;B81B7/02;G01P9/04 主分类号 G01C19/56
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