| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a remaining distortion by heat causing a remaining unevenness of a display of a finished product when directly mounting a liquid crystal driver LSI (Large-Scale Integration) to a glass substrate with the use of the ACF (Anisotropic Conductive Film) or the like. Ž<P>SOLUTION: A semiconductor component has a first coefficient of thermal expansion and a first inductive coupling part for giving and receiving signals to and from the other semiconductor component. A printed circuit board has a second coefficient of thermal expansion different from that of the semiconductor, and includes a second inductive coupling part for giving and receiving signals with the first inductive coupling part. A circuit board fixes the semiconductor component to the printed circuit board with the first inductive coupling part and the second inductive coupling part placed opposite, and signals are given and received among the semiconductor components. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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