| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package of high reliability, which suppresses the occurrence of cracks which have frequently occurred in a sealing step where a package sealed by frit is sealed using laser. <P>SOLUTION: In the method of manufacturing a package having a space sealed between two substrates by heating frit disposed like a ring between two substrates by laser irradiation to bond the two substrates, in the laser irradiation, two or more laser beams are scanned so that their trajectories together form a pattern of the ring-shaped frit, and each laser beam is scanned so that other laser beams exist at the start point and the end point of its trajectory during a period from melting to solidification of the frit. <P>COPYRIGHT: (C)2010,JPO&INPIT |
