ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND MANUFACTURING PROCESSES OF THEM

摘要

PROBLEM TO BE SOLVED: To provide an electroconductive layer that retains bondability to a resin layer certainly and allows a copper-tin alloy layer to be easily removed in a post-step, to provide a laminate using the same, and to provide a manufacturing processes of them.

SOLUTION: The electroconductive layer (10) to be bonded to a resin layer (4) includes a copper layer (1) and a copper-tin alloy layer (3) laminated on the copper layer (1), wherein the copper-tin alloy layer (3) has a thickness of 0.001 to 0.020μm.

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