| 摘要 |
An interconnection is formed on an object having a step by a screen printing method. The interconnection is formed by printing it on a substrate having an upper stage surface and a lower stage surface. A multilayer interconnection structure having a plurality of layers which are stacked is formed by repeatedly performing a process of printing and drying an interconnection pattern on the lower stage surface. Then, when the height of the multilayer interconnection structure approaches the height of the upper stage surface, an interconnection pattern of the uppermost layer is printed on the multilayer interconnection structure to extend onto the upper stage surface. Because the interconnection pattern of the uppermost layer is printed in a smaller step, the print characteristic is good. Thus, by the printing, the interconnection structure is formed which has a narrow interconnection width and surely connects the upper surface and the lower surface in a larger step than the interconnection width.
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