发明名称 PHASE CHANGE RANDOM ACCESS MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A phase change memory device and a manufacturing method thereof are provided to increase thermal stability of a phase change material by reducing the number of memory cells on the same line in half. CONSTITUTION: An impurity region is formed on a semiconductor substrate. A first memory cell includes a first bottom electrode, a first bottom electrode contact(160), and a first phase change pattern layer which are successively stacked on the impurity region. A second memory cell is diagonally separated from the first memory cell with a preset distance. The second memory cell includes a second bottom electrode, a second bottom electrode contact(200), and a second phase change pattern layer which are successively stacked on the impurity region.</p>
申请公布号 KR20100050109(A) 申请公布日期 2010.05.13
申请号 KR20080109237 申请日期 2008.11.05
申请人 HYNIX SEMICONDUCTOR INC. 发明人 RYU, IN CHEOL;OH, JAE MIN;CHO, BYUNG JICK
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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