SEMICONDUCTOR WAFER AND METHOD OF SEPARATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer which allows separating with excellent straightness while suppressing an increase in the number of modified regions.

SOLUTION: The semiconductor wafer includes a semiconductor substrate 7 that has multiple predetermined separation lines 3 extending from the upper surface to the lower surface and multiple chip regions 2 delimited by the predetermined separation lines 3. Tensile stress is applied to regions having the predetermined separation lines 3 of the semiconductor substrate 7, thus facilitating separation of the semiconductor wafer.

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