发明名称 EXPANDING DEVICE AND EXPANDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an expanding device that cuts an adherend W stuck on an adhesive sheet S into a plurality of small pieces WT and expands the adhesive sheet S to form gaps between those small pieces WT, the expanding device eliminating the need for a troublesome setting operation for machine components, being compact, and having a simple structure. SOLUTION: The expanding device has a stage 1 where an adherent W is mounted with the adhesive sheet S interposed. On a surface of the stage 1, a recessed groove 11 is formed at a position where an area of the adhesive sheet S projecting from an outer edge of the adherend W is mounted, and the adhesive sheet S is sucked into the recessed groove 11 by a suction means 2 to expand the adhesive sheet S positioned inside the recessed groove 11. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010108996(A) 申请公布日期 2010.05.13
申请号 JP20080276905 申请日期 2008.10.28
申请人 LINTEC CORP 发明人 YOSHIOKA TAKAHISA
分类号 H01L21/301;H01L21/67 主分类号 H01L21/301
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