发明名称 Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer
摘要 According to one exemplary embodiment, a non-destructive method for determining a breakdown voltage of a dielectric layer on a semiconductor substrate includes injecting a test current in increasing ramp steps into the dielectric layer. The method further includes measuring a test voltage across the dielectric layer at each increasing ramp step of the test current. The method further includes detecting a dropped test voltage in response to the increasing ramp steps of the test current. The ramp steps of the test current can be substantially logarithmically increased. The breakdown voltage of the dielectric layer can be designated to be substantially equal to the dropped test voltage.
申请公布号 US2010117676(A1) 申请公布日期 2010.05.13
申请号 US20080291738 申请日期 2008.11.12
申请人 ADVANCED MICRO DEVICES, INC. 发明人 YIANG KOK YONG;FRANCIS RICK;MARATHE AMIT P.;PHAM VAN-HUNG
分类号 G01R31/12 主分类号 G01R31/12
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