发明名称 |
ANISOTROPIC ELECTROCONDUCTIVE ADHESIVE AND METHOD FOR MANUFACTURING CONNECTED STRUCTURE USING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an anisotropic electroconductive adhesive which can achieve high electrical connection reliability even when a heating tool is brought in contact with or pressed on the anisotropic electroconductive adhesive at a low rate; and to provide a method for manufacturing a connected structure using the anisotropic electroconductive adhesive. <P>SOLUTION: The anisotropic electroconductive adhesive prepared by dispersing electroconductive particles in an insulative adhesion component containing a radical-polymerizable compound, a radical initiator, and a film-forming resin has a minimum melt viscosity in the range of 100 to 800 Pa s and a temperature demonstrating the minimum melt viscosity, in the range of 90 to 115°C. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010106261(A) |
申请公布日期 |
2010.05.13 |
申请号 |
JP20090224181 |
申请日期 |
2009.09.29 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORP |
发明人 |
SATO DAISUKE;HAYASHI SHINICHI |
分类号 |
C09J9/02;C09J4/02;C09J11/06;C09J11/08;C09J163/00;C09J171/10;C09J201/00;H01R11/01;H01R43/00 |
主分类号 |
C09J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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