| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain reduction in size and improvement in the flexibility of layout, by preventing magnetic flux generated by an inductor from affecting another active element, in a semiconductor device where a plurality of chips are laminated. <P>SOLUTION: A semiconductor device 100 is provided with a first substrate 101, with which a passive element 107 is formed on one side and a shielding layer 113 is formed on the other side; and a second substrate 117, with which an active element 119 is formed on one side. The first substrate 101 is packaged on the second substrate 117, the side with the shielding layer 113 formed thereon is turned to face the second substrate 117. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
