发明名称 |
A PRINTED CIRCUIT BOARD COMPRISING AN ANTI-MOISTURE-ABSORPTION FILM AND A METHOD OF MANUFATURING THE SAME |
摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent the separation of the printed circuit board at the high temperature process by preventing the moisture absorption of the insulating layer through the moisture absorption prevention film. CONSTITUTION: A printed circuit board(300) comprises an insulating layer, a circuit layer, and a moisture absorption prevention film(700). The circuit layer is formed on the insulating layer. The circuit layer comprises the circuit pattern for transferring the electric signal. The moisture absorption prevention film is formed with the roll coating in the lateral part of the printed circuit board. The moisture absorption prevention film prevents the moisture absorption of the insulating layer. The moisture absorption prevention film is made of materials which has hydrophobic property.
|
申请公布号 |
KR20100049966(A) |
申请公布日期 |
2010.05.13 |
申请号 |
KR20080109027 |
申请日期 |
2008.11.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HONG, MYEONG HO;CHOI, BYUNG KWAN;KIM, GEON JOO |
分类号 |
H05K1/02;H05K3/28 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|