发明名称 METHOD FOR MANUFACTURING WIRING STRUCTURE AND CIRCUIT BODY
摘要 <P>PROBLEM TO BE SOLVED: To improve electric connection reliability further while keeping connection simple. Ž<P>SOLUTION: A method for manufacturing a wiring structure includes: a step of forming a plurality of lead wires 42 which have electrode lands 42a on an upper surface of base material 41 whose thermal expansion and contraction is reversible; a step of forming a covering layer 43 which has a smaller thermal expansion coefficient than the base material 41 and whose thermal expansion and contraction is reversible such that it covers the lead wires 42 on the upper surface of the base material 41; a step of forming a through-hole 41a at a part where the electrode land 42a is disposed on the base material 41; a step of forming a relay conductor 44 which is conducted to the electrode 42a in the through-hole 41a; a step of forming a conductive and flexible bump 39 on the electrode terminal 24a of a piezoelectric actuator 12; a step of enlarging a diameter of the through-hole 41a by heating an FPC (Flexible Printed Circuit) 13; and a step of reducing diameter of the through-hole 41a by canceling heating in such a state that the bump 39 is inserted in the through-hole 41a whose diameter has been enlarged. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010105298(A) 申请公布日期 2010.05.13
申请号 JP20080280750 申请日期 2008.10.31
申请人 BROTHER IND LTD 发明人 YAMASHITA TORU
分类号 B41J2/16;B41J2/045;B41J2/055 主分类号 B41J2/16
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