发明名称 MOLD AND SUBSTRATE FOR USE WITH MOLD
摘要 A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28).
申请公布号 US2010117202(A1) 申请公布日期 2010.05.13
申请号 US20080269058 申请日期 2008.11.12
申请人 FREESCALE SEMICONDUCTOR, INC 发明人 EU POH LENG;LOW BOON YEW;WONG WAI KEONG
分类号 H01L29/06;B29C45/03;H01L21/00 主分类号 H01L29/06
代理机构 代理人
主权项
地址